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Failure Analyze
1. Electrical property test ：FT、O/S;
2. Visual inspection ：40X microscope;
3. SAM inspection：C-SCAN、 A-SCAN、T- SCAN、B-SCAN;
4. X-ray inspection : to check wire, die bond quality and so on;
5. Decap analysis：to check the surface of die by 100-1000X Microscope;
6. Cratering test：to check wire bond quality;
7. Cross-section & SEM\EDX analysis：to check sample surface and composition.
1. Electrical property test ：FT、O/S;
2. Visual inspection ：40X microscope;
3. SAM inspection：C-SCAN、 A-SCAN、T- SCAN、B-SCAN;
4. X-ray inspection : to check wire, die bond quality and so on;
5. Decap analysis：to check the surface of die by 100-1000X Microscope;
6. Cratering test：to check wire bond quality;
7. Cross-section & SEM\EDX analysis：to check sample surface and composition.
